ORMECON RAD 7000 c
Rinse Aid for ORMECON CSN Classic Immersion Tin Processes
-------------------ORMECON RAD 7000 c 用于ORMECON CSN 经典浸锡工艺的漂洗助剂
CHARACTERISTICS【简介】
ORMECON RAD 7000 C is an aqueous, alkaline, liquid concentrate used to assist in the removal of residueson PCB (printed circuit boards) following the initial water rinsing of ORMECON CSN 7004 immersion tinbath. When diluted with deionized water the ORMECON RAD 7000 C neutralize acidic residues left on the PCB from the immersion tin bath, significantly reducing ionic contamination levels on the boards. It can be used in either spray or immersion applications. ORMECON RAD 7000 C is free rinsing and completely compatible with the entire line of CSN Classic lmmersion Tin process chemistries. ORMECON RAD 7000 C是一种水性，碱性，液体浓缩物，用于在ORMECON CSN 7004浸泡锡槽初始水冲洗后协助去除PCB(印刷电路板)上的残留物。当用去离子水稀释时，ORMECON RAD 7000 C可以中和浸泡锡槽中留在PCB上的酸性残留物，显著降低电路板上的离子污染水平。它可以用于喷雾或浸泡应用。ORMECON RAD 7000 C是免费漂洗，完全兼容整个系列的CSN经典lmmersion锡工艺化学。
OPERATING CONDITIONS【操作参数】
Horizontal Range Nominal
Concentration（浓度） 1.0 to 25% by volume 5.0%
Temperature （温度） 40 to 60 C (104 to 140°F) 50°C (122 °F)
MAKE-UP PROCEDURE【组成】
Before handling any of the products referred to in this data sheet ensure all relevant Safety Data Sheets have been read and understood. 在处理本数据表中提到的任何产品之前，确保已阅读和理解所有相关的安全数据表。
To make up the ORMECON RAD 7000 Post Treatment Rinse Aid add the required amount of ORMEConRAD 7000 C to heated, recirculating, water. 为配制ORMEConRAD 7000处理后漂洗助剂，将所需量的ORMEConRAD 7000 C加入加热的循环水中。
OPERATION【操作】
PCB panels must be thoroughly rinsed with Dl water prior to entering the ORMECON RAD 7000 C rinse aid.DO NOT use ORMECON RAD 7000 C immediately following ORMECON 7004 CSN immersion tin bath without a water rinse. Typical dwell times in ORMECON RAD 7000C are between 20 and 90 seconds. ORMECON RAD 7000 C is always followed by thorough water rinsing to ensure removal of the rinse aid solution from the PCB board surface. Deionized water should be used in the final rinse to achieve the required ionic cleanliness. ORMECON RAD7000 C treatment is especially recommended for complex board designs, as well as blind vias and solder mask plugged holes. 在进入ORMECON RAD 7000 C冲洗助剂之前，PCB板必须用Dl水彻底冲洗。在没有水冲洗的情况下，不要在ORMECON 7004 CSN浸泡锡浴后立即使用ORMECON RAD 7000c。ORMECON RAD 7000C的典型停留时间在20到90秒之间。ORMECON RAD 7000 C清洗后必须进行彻底的水冲洗，以确保PCB板表面的漂洗辅助溶液被清除。冲洗时应使用去离子水，以达到所需的离子清洁度。ORMECON RAD7000 C处理特别推荐用于复杂的电路板设计，以及盲孔和阻焊塞孔
